Method and apparatus for positioning heating elements

ABSTRACT

An underlayment system is provided that includes a plurality of bosses that emanate form a common base member. The bosses and bases preferably include an opening therethrough that will allow for subsequent layers of adhesive to interact and bond to each other. The bosses are also spaced in such a way to help secure a wire snugly therebetween.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.12/550,111, filed Aug. 28, 2009, the entire disclosure of which ishereby incorporated herein by reference.

FIELD OF THE INVENTION

Embodiments of the present invention are generally related tounderlayments associated with radiant floor or wall heating systems.More specifically, one embodiment of the present invention includes aplurality of protrusions that are adapted to locate and firmly securewires or pipes associated with a radiant heating system.

BACKGROUND OF THE INVENTION

In-floor and in-wall heating and cooling is well known that utilizesheat conduction and radiant heat, for example, for indoor climatecontrol rather than forced air heating that relies on convection. Theheat is usually generated by a series of pipes that circulate heatedwater or by electric cable, mesh or film that provide heat when acurrent is applied thereto. In-floor radiant heating technology is usedcommonly in homes and businesses today.

Electrical floor heating systems have very low installation costs andare well suited for kitchens, bathrooms or in rooms that requireadditional heat, such as basements. One advantage of electric floorheating is the height of installation. For example, floor buildup can beas little as about one millimeter as the electric cables are usuallyassociated with a specialized installation board or directly onto thesub floor. Electric underfloor heating is also installed very quickly,usually taking a half a day to a day depending on the size of the areato be heated. In addition, warm up times are generally decreased becausethe cables are installed approximate to the finished flooring, i.e.tile, wherein direct connection is made with the heat source rather thana stored water heater as in fluid-based systems. Electric systems areoffered in several different forms, such as those that utilize a longcontinuous length cable or those that employ a mat with embedded heatingelements. In order to maximize heat transfer, a bronze screen or carbonfilm heating element may be also used. Carbon film systems are normallyinstalled under the wire and onto a thin insulation underlay to reducethermal loss to the sub floor. Vinyls, carpets and other soft floorfinishes can be heated using carbon film elements or bronze screenelements.

Another type of in-floor heating system is based on the circulation ofhot water, i.e., a “hydronic” system. In a hydronic system, warm wateris circulated through pipes or tubes that are incorporated into thefloor and generally uses pipes from about 11/16 inch to 1 inch tocirculate hot water from which the heat emanates. The size of tubesgenerally translates into a thicker floor, which may be undesirable. Oneother disadvantage of a hydronic system is that a hot water storage tankmust be maintained at all times, which is less efficient than anelectric floor heating system.

In order to facilitate even heating of a floor, the wires mustpreferably be spaced at specific locations. One such system is disclosedin U.S. Patent Application Publication No. 2009/0026192 to Fuhrman(“Fuhrman”), which is incorporated by reference in its entirety herein.Fuhrman discloses a mat with a plurality of studs extending therefromthat help dictate the location of the wires. The mat with associatedstuds is placed over a sub floor with a layer of adhesive therebetween.Another layer of adhesive is placed above of the studs. The studs alsoguide the finishers to form a correct floor thickness. The studs thusprovide a location for interweaving the wire or wires that are used inthe heating system. The wire of Fuhrman, however, is not secured betweenadjacent studs and still may separate therefrom, which may cause unevenheating or wire damage. Furthermore, Fuhrman discloses a continuous matwherein subsequent layers of adhesive are not able to interact withthose previously placed.

Thus it is a long felt need in the field of flooring to provide a systemthat allows for the location and securement of various wires associatedwith an in floor heating system that also facilitates the creation of asturdy floor. The following disclosure describes an improvedunderlayment that is adapted for securing a plurality of wires or watertubes, which also provides the mechanism for allowing successive layersof adhesive to interact with each other to form a more cohesive flooringsystem.

SUMMARY OF THE INVENTION

It is one aspect of the present invention to provide a system forsecuring a plurality of wires or tubes associated with an in floorheating system (hereinafter “heating element”). More specifically, oneembodiments of the present invention is a system comprised of a basemember with a plurality of bosses emanating therefrom. The bosses arespaced in such a way to firmly secure at least one heating elementtherebetween. Some embodiments of the present invention also employ ringshaped bosses, which will be described in further detail below. Again,the bosses are preferably positioned in such a way to firmly secureheating elements, thereby protecting the wire and maintaining apreferred location thereof. In one embodiment of the present inventionthe lower layer of the base is applied with heat reflective thin foillayer that directs heat toward the finished floor as opposed to thesubfloor. The underlayment layer of one embodiment of the presentinvention is made by vacuum forming, thermal forming, injection molded,blow molded, cast or any other similar forming technique.

It is another aspect of the present invention to provide an underlaymentlayer that facilitates bonding of successive flooring layers. Morespecifically, the base of one embodiment of the present inventionincludes at least one opening that allows adhesive applied above andbelow the underlayment layer to communicate. “Adhesive” as used hereinshall mean thin set, mortar, grout, self-leveling underlayment, etc.Adhesives are used to firmly associate the underlayment layer with asubfloor, wherein a layer of adhesive is initially applied to thesubfloor with the underlayment layer placed thereon. Some embodiments ofthe present invention include a base with a roughened contact surface orthat is associated with a wire or plastic mesh material to helpfacilitate the bond between the underlayment layer and the layer ofadhesive. Next, the plurality of heating elements are associated withthe bosses of the underlayment layer. Once the predetermined wireconfiguration is achieved, a second adhesive layer is placed atop of theunderlayment layer and associated wires, which fills the spaces betweenadjacent bosses. Grout or other adhesives are then placed atop of thesecond layer of adhesive that is adapted to receive tiles, wood flooringetc. In one embodiment of the present invention, the base includes atleast one opening therethrough to allow the first layer of adhesive tointeract with the second layer of adhesive, thus providing a continuousadhesion path through the thickness of the underlayment layer.

The opening (and holes described below) may also allow water to flowthrough the underlayment layer. More specifically, often in floorheating systems are used in outdoor environments. The openings in thebosses and the base may thus be used to allow water flow from the floorthrough the subfloor to a catch basin or a drainage system. The openingsalso allow for air to percolate through the floor during fabrication,which helps some types of adhesive cure.

In a related aspect of the present invention, embodiments employ a bosshaving an opening therethrough. That is, some bosses of the presentinvention are ring shaped having an inner diameter and an outerdiameter. The inner diameter may also be associated with an opening inthe base such that the second layer of adhesive may be located withinthe boss to communicate with the first layer of adhesive which alsocreates an enhanced bond between the first layer of adhesive and thesecond layer of adhesive. Bosses of some embodiments of the presentinvention are also at least partially hollow with a plurality of holesassociated with an upper surface thereof. The hollow bosses decrease theweight of the underlayment layer which facilitates placement of thesame. In addition, material savings are appreciated by using hollowbosses. Hollow bosses may in one embodiment receive a first layer ofadhesive such that the second layer of adhesive communicates with thefirst layer of adhesive through the plurality of holes. Otherembodiments of the present invention omit such holes and provide anairtight or at least semi airtight volume of air that is heated by theheating elements to help regulate the heat being emanated by the floor.

It is another aspect of the present invention to provide spacing betweenadjacent bosses that is uniquely suited to the diameter or shape of theheating element to help firmly secure the same. In addition, someembodiments of the present invention employ bosses that are non rigidand somewhat compliant that flex to receive the heating element. Thisinterference or frictional fit between heating element and boss helpssecure and protect the heating elements.

It is another aspect of the present invention to provide an underlaymentlayer with at least one boss that helps facilitate the remainingconstruction of the floor. More specifically, some embodiments of thepresent invention include bosses with upwardly projecting protrusionsthat act as guides to help the finisher ascertain the amount of adhesiveor grout needed to bring the floor up to a predetermined grade. It iscontemplated that such protrusions be used to place grout atop thebosses wherein top surfaces of the protrusions remain uncovered by thegrout to define the finished grade. This will allow the finisher to beconfident that the grout is at the desired level without having to makemany measurements.

It is another aspect of the present invention to provide bosses havingan outwardly protruding lip. More specifically, in one embodiment, theupper portion of the boss side surface, which will be shown in greaterdetail below, may be comprised of a continuous surface or at least onetab that ultimately is positioned in the space between adjacent bosses.Preferably, the tab is resiliently deflectable such that the heatingelement may be placed between adjacent bosses by flexing the same.Thereafter, the surface or tab will help maintain the position of theheating element between two adjacent bosses.

It is one aspect of the present invention to provide an underlaymentthat is adapted to receive and secure at least one heating element of aradiant heating assembly, comprising: a first base having an outerdiameter and an inner diameter; a first boss having an outer diameterand an inner diameter extending from the first base, the first bosshaving a first outer surface; a second base having an outer diameter andan inner diameter; a second boss having an outer diameter and an innerdiameter extending from the second base, the second boss having a secondouter surface; and wherein the first outer surface and the secondsurface are spaced a predetermined distance to frictionally secure theat least one heating element.

It is another aspect of the present invention to provide an underlaymentlayer having a base with a plurality of bosses extending therefrom,wherein at least one boss of the plurality thereof includes an openingtherethrough and wherein the base includes at least one opening betweenthe plurality of bosses; and a heating member positioned between bossesof the plurality thereof wherein the bosses firmly secure the heatingmember.

It is yet another aspect of the present invention to provide a method ofinstalling a floor, comprising: providing a sub-floor; providing anunderlayment layer having a base with a plurality of bosses therefrom,wherein at least one boss of the plurality thereof includes an openingtherethrough and wherein the base includes at least one opening betweenthe plurality of bosses; bonding the underlayment layer to the subfloorwith an adhesive layer therebetween and associating a heating member;and locating a heating member between bosses of the plurality thereofwherein the bosses firmly secure the heating member.

It is still yet another aspect of the present invention to provide anunderlayment for association with an in-floor heating element, theunderlayment layer comprising a base layer with a first boss and asecond boss extending therefrom that are adapted to secure the heatingelement, the improvement comprising: a hole though the first boss.

The Summary of the Invention is neither intended nor should it beconstrued as being representative of the full extent and scope of thepresent invention. Moreover, references made herein to “the presentinvention” or aspects thereof should be understood to mean certainembodiments of the present invention and should not necessarily beconstrued as limiting all embodiments to a particular description. Thepresent invention is set forth in various levels of detail in theSummary of the Invention as well as in the attached drawings and theDetailed Description of the Invention and no limitation as to the scopeof the present invention is intended by either the inclusion ornon-inclusion of elements, components, etc. in this Summary of theInvention. Additional aspects of the present invention will become morereadily apparent from the Detail Description, particularly when takentogether with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of the specification, illustrate embodiments of the invention andtogether with the general description of the invention given above andthe detailed description of the drawings given below, serve to explainthe principles of these inventions.

FIG. 1 is a perspective view of an underlayment layer of one embodimentof the present invention;

FIG. 2 is a top plan view of FIG. 1;

FIG. 3 is a partial top plan view of FIG. 2 showing wires positionedbetween adjacent bosses;

FIG. 4 is a front elevation view of FIG. 3;

FIG. 5 is a partial cross-sectional view of FIG. 2;

FIG. 6 is a partial cross-sectional view of a flooring system of oneembodiment of the present invention;

FIG. 7 is a top plan view of a boss and base of another embodiment ofthe present invention;

FIG. 8 is a top plan view of a boss and base of another embodiment ofthe present invention;

FIG. 9 is a cross-sectional view of a boss and base of anotherembodiment of the present invention; and

FIG. 10 is a front elevation view of FIG. 9 subsequent to formingthereof.

To assist in the understanding of the present invention the followinglist of components and associated numbering found in the drawings isprovided herein:

# Components 2 Underlayment layer 6 Base 10 Boss 14 Outer surface 18Inner surface 22 Upper surface 26 Hole 30 Outer diameter 34 Innerdiameter 38 Opening 42 Opening 46 Wire 50 Flooring system 54 Sub floor56 Adhesive 58 Channel 60 Anti-fracture membrane 62 Adhesive 66 Flooringmember 70 Grout 74 Wall 78 Lip

It should be understood that the drawings are not necessarily to scale.In certain instances, details that are not necessary for anunderstanding of the invention or that render other details difficult toperceive may have been omitted. It should be understood, of course, thatthe invention is not necessarily limited to the particular embodimentsillustrated herein.

DETAILED DESCRIPTION

Referring now to FIGS. 1-5, an underlayment layer 2 of one embodiment ofthe present invention is shown that includes a system of interconnectedbases 6 and bosses 10. That is, preferably, each base 6 includes a boss10 extending therefrom. Each boss 10 includes an outer surface 14 and aninner surface 18 and an upper surface 22. In some embodiments the uppersurface 22 includes a plurality of holes 26. The bases 6 are generallycircular and the bosses 10 are generally cylindrical. The bases 6 alsoinclude an outer diameter 30 and inner diameter 34. Again, a pluralityof base/boss combinations are interconnected to form the underlaymentlayer 2.

The bosses 10 of one embodiment of the present invention are betweenabout 1/16 inches wide. The spacing between individual bosses 10 isbetween about 1 inch to 1.5 inches. One skilled in the art, however,will appreciate that the boss sizes and spacing therebetween may bealtered to accommodate different sizes of heating elements. That is, theconcepts as shown herein may be freely scalable to accommodate anyheating element. The bosses of some embodiments of the present inventionextend at least about 3/16 inches from the base. The boss/basecombinations are interconnected and include an opening 38 therebetweento help to facilitate bonding and curing of adhesives positioned aboveand below the underlayment layer 2. The bases may also include anopening 42 position within the inner surface 18 of each boss 10 tofacilitate adhesive bonding as well. Referring now specifically to FIGS.3-5, the interaction between a wire 46, i.e. a “heating element” and thebosses 10 is shown. Here, the bosses 10 possess a frustoconical orsemispherical outer surface, wherein the diameter of a lower portion ofthe outer surface 14 is less than the diameter of the upper portionthereof. In some embodiments of the present invention the lower diameteris about ⅞ inches. This configuration allows for the wire 46 to fitsnugly between adjacent bosses 10. The wire 46 may be slid between thebosses 10 parallel to the base 6. Preferably, however, the wire 46 isforced downwardly between two bosses 10.

Preferably, the bases 6 and bosses 10 are made of fiber polyethylene,polystyrene or polypropylene and are blow molded, thermally extruded,vacuum and/or pressure formed, and thermally molded. The bosses 10 areof such a material not to deform a temperatures as high as 104 degreesF. and preferably withstand temperatures of about 120 degrees F.

Referring now specifically to FIG. 5, a cross sectional view of aplurality of bosses 10 is shown. Here, the bosses 10 are hollow or atleast partially hollow to allow a volume of air to reside therein. Theair helps maintain the temperature of the floor as air is an excellentinsulator to heat. One of skill in the art will appreciate that thebosses may be filled with any heat conducting or heat insulatingmaterial without departing from the scope of the invention. Someembodiments of the present invention include an upper surface 22 havinga plurality of holes that provide an entrance into the internal volumeof the boss 10. The boss 10 may also include a plurality of holes in thebottom portion thereof to allow for adhesive to communicate through thebody of the boss 10.

Referring now to FIG. 6, a cross-sectional view of a flooring system 50of one embodiment of the present invention is shown. In one embodimentof the present invention, a sub floor 54, for example, plywood, ispresent with an adhesive 56 applied thereon. The “adhesive” as usedherein includes thin set or modified thin set, where thin set is capableof curing in the absence of oxygen or air and modified thin set isincapable of curing in the absence of oxygen or air (e.g., due to theinclusion of polymers in a modified thin set).

The underlayment layer 2 is placed a top the adhesive 56 and firmlysecured thereto, preferably via an anti-fracture membrane 60. Morespecifically, embodiments of the present invention contemplate providingan anti-fracture membrane (or similar type of membrane or material) inthe form of a woven substrate or layer that is removably attached to theunderside of the underlayment layer 2 (perhaps by an adhesive or by alamination-type process whereby the underlayment layer 2 is heated upand the anti-fracture member 60 is pressed there against to create aphysical bond between the anti-fracture membrane 60 and the underlaymentlayer 2).

Some embodiments of the present invention include an underlayment layer2 with a roughened bottom surface that allows for the adhesive tosecurely adhere thereto. Other embodiments include an integrated orotherwise associated wire, woven, or plastic mesh, preferably in theform of the anti-fracture membrane 60, to help facilitate the bondbetween the adhesive 56 and the underlayment layer 2. Although ananti-fracture membrane 60 is described herein as a layer of wire, woven,and/or plastic mesh, one skilled in the art will appreciate that theanti-fracture membrane 60 may include any type of material orcombination of materials in any type of format that is capable offacilitating a physical connection between the underlayment layer 2 andthe adhesive 56 and/or isolating cracks in the sub floor by displacingmechanical stresses across a broader area of the underlayment layer 2.

A plurality of wires 46 or one wire 46 laid in a serpentine path isplaced within the channels 58 between bosses 10. Although one wire 46 isshown positioned between the bosses 10, one skilled in the art willappreciate that a single wire may be placed between bosses 10 in azig-zag or serpentine configuration. Alternatively, a plurality of wiresmay be placed on the underlayment layer 2 in a preferred configuration,usually depending upon the desired heating.

After the wires 46 are placed in the predetermined location, anotherlayer of adhesive 62 is applied atop the underlayment layer 2. Thesecond adhesive 62 layer will necessarily fill the spaces between thebosses 10 and will fill the internal space of each boss 10 and interactwith the first layer of adhesive 58 to form a cohesive structure. Thesecond adhesive layer 62 may reside over the top surface 22 of thebosses 10 as well or may be flush with the bosses 10. Adhesive 62 isassociated with a plurality of flooring members 66, such as tile, stone,brick, pavers, slate, concrete, or wood with grout 70 positionedtherebetween.

Referring now to FIG. 7, a plan view of another embodiment of aboss/base is shown. Here, the boss does not have a smooth outer surface14 but one that is faceted to engage the wires. The faceted outersurface has the advantage of being easier to mold. Other advantagesinclude crack isolation and/or a more secure retention of heatingelements.

Referring now to FIG. 8, another embodiment of the invention is shownthat employs a boss 10 generally without an upper surface. This boss 10is simply an outer wall 74 that engages the wires. The boss may have anopening 42 therethrough to facilitate interaction between subsequentlayers of adhesive.

Referring now to FIGS. 9 and 10, yet another embodiment of the presentinvention is shown that includes a lip 78. More specifically, thesebosses 10 are similar to those shown in FIGS. 1-6 that include openings42 in the base 6 and the upper surface 22 of the boss 10. As can beappreciated, the outer surface 14 of the boss 10 has a frustoconical orsemispherical shape. The lip 78 is associated with the upper surface 22of the boss and extends upwardly therefrom. Subsequently to forming theboss, the lip 78 is made to protrude gradually from the upper surface22. The lip 78 is preferably selectively deflectable to help facilitateinsertion of a wire 46 between adjacent bosses. The lip 78 then helpsmaintain the wire 46 between adjacent bosses 10. One skilled in the artwill appreciate that the lip 78 may be replaced by at least one tabpositioned between adjacent bosses without departing from the scope ofthe invention.

While various embodiments of the present invention have been describedin detail, it is apparent that modifications and alterations of thoseembodiments will occur to those skilled in the art. However, it is to beexpressly understood that such modifications and alterations are withinthe scope and spirit of the present invention, as set forth in thefollowing claims.

What is claimed is:
 1. An underlayment layer for use in a radiant-heating system, the underlayment layer comprising: a plurality of bosses disposed in a matrix orientation on top of a single base layer, each of the plurality of bosses comprising an upper surface and a curved outer surface forming a bowl, wherein a first perimeter of the curved outer surface adjacent the base layer of least one boss is shorter than a second perimeter of the curved outer surface at a height approximately halfway between the single base layer and the upper surface of the at least one boss, and further wherein the second perimeter is shorter than a maximum perimeter of the curved outer surface of the at least one boss.
 2. The underlayment layer of claim 1, wherein the maximum perimeter of the curved outer surface of the at least one boss extends above a heating element interposed between the at least one boss and an adjacent boss.
 3. The underlayment layer of claim 2, wherein a flexible portion of the at least one boss is resiliently deflectable such that the heating element may be placed between the at least one boss and the adjacent boss by flexing the flexible portion of the at least one boss.
 4. The underlayment layer of claim 2, wherein the heating element is frictionally secured between the at least one boss and the adjacent boss.
 5. The underlayment layer of claim 1, wherein the single base layer comprises a plurality of openings that allow adhesive applied above and below the single base layer to communicate with one another.
 6. The underlayment layer of claim 5, wherein the adhesive comprises a thin set.
 7. The underlayment layer of claim 5, wherein the adhesive comprises at least one of mortar, grout, and self-leveling underlayment.
 8. The underlayment layer of claim 1, wherein the single base layer is directly bonded to a woven substrate.
 9. The underlayment layer of claim 1, wherein the curved outer surface is faceted.
 10. The underlayment layer of claim 1, wherein the curved outer surface is smooth. 